ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,607, issued on July 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Vapor deposition processes, reactants and deposition asse... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,608, issued on July 7, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method for manufacturing the same" was i... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,609, issued on July 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Germanium and silicon stacks for 3D NAND" was invented... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,610, issued on July 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method for processing a substrate" was invented by DongHy... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,611, issued on July 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was inv... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,612, issued on July 7, was assigned to Kokusai Electric Corp. (Tokyo). "Method of processing substrate, method of manufacturing semiconducto... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,613, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Heat dissipation for field effect... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,614, issued on July 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Plasma edge ring, plasma etching apparatus ... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,615, issued on July 7, was assigned to DISCO Corp. (Tokyo). "Method for processing device wafer" was invented by Naoko Yamamoto (Tokyo). Ac... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,616, issued on July 7, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing method, method of manufacturing semiconductor d... Read More